As a major global producer and consumer of semiconductor wafers, our country holds a pivotal position in the semiconductor industry chain.

　　Currently, the market share of domestically produced wafer thinning grinding wheels is relatively low, at approximately 10%. This means that a significant portion of the market share is still occupied by foreign brands. However, this also presents us with enormous opportunities for substitution and significant potential market opportunities. With the increasing emphasis and support from the government for the semiconductor industry, and continuous advancements in technology research and development and production processes by domestic enterprises, we have reason to believe that the market share of domestically produced wafer thinning grinding wheels will significantly increase.

　　Wafer thinning grinding wheels, as a crucial component of semiconductor cutting and grinding tools, come in a wide variety of types, each with its own unique characteristics. Based on the different materials added, wafer thinning grinding wheels can be categorized into silicon carbide grinding wheels, diamond grinding wheels, aluminum oxide grinding wheels, gallium arsenide grinding wheels, ceramic grinding wheels, resin grinding wheels, and many other types. These different types of wafer thinning grinding wheels have varying degrees of hardness, wear resistance, and cutting efficiency, suitable for semiconductor cutting and grinding needs with different materials and processes. Therefore, while promoting the development of domestically produced wafer thinning grinding wheels, we must also focus on technological innovation and product development to meet the diversified needs of the market.

　　Wafer thinning grinding wheels are mainly used in the thinning and precision grinding processes of semiconductor wafers, serving as one of the essential tools for wafer thinning. The thinning process involves grinding and thinning the back material of the chip to achieve the target thickness. This process not only reduces the package size and improves circuit performance but also facilitates heat dissipation and enhances the service life of the chip. In recent years, with the development of chip miniaturization and the upgraded demand for heat dissipation, the application demand for wafer thinning grinding wheels has been continuously released.

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